Insiders say that China's largest flash memory chip manufacturer, YMTC, is planning to expand into the field of dynamic random access memory chip (DRAM) manufacturing, including advanced versions that can be used for artificial intelligence chipsets.
According to two anonymous sources cited by Reuters on Thursday (September 25), Changjiang Storage is developing an advanced chip packaging technology called Through Silicon Via (TSV) for stacking DRAM to produce high bandwidth memory (HBM) chips.
A source familiar with the matter also said that Changjiang Storage is considering using some of its newly built factory capacity in Wuhan for DRAM chip production.
According to data from the enterprise information platform Qichacha, earlier this month, Changjiang Storage established a new company responsible for building the third chip factory in Wuhan, with a registered capital of 20.7 billion yuan (approximately 3.74 billion Singapore dollars).
According to reports, this measure highlights the urgent need for China to accelerate the improvement of its advanced chip manufacturing capabilities after the United States expanded export controls and restricted Beijing's access to HBM in December last year.
At present, HBM chips are mainly produced by Micron in the United States, SK Hynix in South Korea, and Samsung Electronics, and are used to manufacture AI chipsets sold by companies such as NVIDIA and AMD.
Changjiang Storage's main competitor in China, CXMT, is also developing HBM chips.
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